Packaging Service

LioniX International offers several solutions and services for assembly and packaging of Photonic Integrated Circuits (PIC). These specifically apply to prototypes, demonstration models and small-volume series of end products. LioniX International offers services to support you with the realization of your complete optical system. From singulation and characterization of bare chips and pieces of wafers […]

Multi Project Wafer Service


LioniX International develops customized MEMS solutions and produces them in small to medium volumes. Visit our MEMS website for more information.