Harness silicon nitride technology for your next project

Take advantage of ultra low-loss TriPleX™ waveguide technology in an easy-access, affordable way with a Multi Project Wafer (MPW) for silicon nitride integrated photonic circuits (PICs).

In an MPW run, we fabricate designs from several users on the same wafer of substrate. This approach controls costs and simplifies the design process, using standardized production steps and materials. The result is affordable access to leading PIC technology for low volume applications like academic research, R+D and prototyping.

Asymmetric double stripe cross-section of the TriPleX™ waveguide in Si3N4 with SiO2 cladding. 

Technology highlights

  • Low loss performance: <0.5 dB/cm @ 1.55µm with proprietary TriPleX™ silicon nitride waveguides
  • Excellent fiber coupling to waveguides with unique asymmetric double stripe cross-section
  • Easy and effective device layout with standardized building blocks

Who uses our MPW runs?

Our silicon nitride MPW is a great fit when you:

  • Are exploring integrated photonics’ possibilities
  • Just need a few chips for your design
  • Are investigating what technology fits your application
  • Are looking for the lowest entry costs

We were excited to access silicon nitride technology through the LioniX International MPW. Our application required really low-loss photonics in chip volumes appropriate to our early-stage technology. The design tools and building-blocks gave us and our partners an efficient way of doing the functional design and the packaging services saved us valuable time on our end.

Our MPWs at a glance

WavelengthTypical applicationsMPW run numberDesign deadline (tape out)Devices ready
Sensing, Quantum
2231 March 202131 Aug 2021
2331 July 202117 Dec 2021
2415 November 202115 April 2022
2531 March 202231 August 2021
850nmBiosensing, OCT, Spectrometry, Metrology3Sept 2021Feb 2022
Visible (400-700nm)Life sciences10June 2021Nov 2021

Additional services

  • Process Design Kit (PDK) available in different tools: Synopsis and Nazca
  • Access training on design tools, design support and design kit
  • Characterization and Packaging Service (CPS): a cost-effective solution to optimize the use of your new PIC leveraging our expertise in fiber coupling and electronics design.
  • Further fabrication steps: trench etching for heat localization and fluidics, glass bonding and fluidic connections.