LioniX International secures major satcom contract

LioniX International has secured a seven-figure contract for the development and fabrication of integrated photonic modules that enable ultra-high capacity broadband satellite communications from flat-panel aeronautical antennas. This contract with ViaSat Antenna Systems S.A. is part of the ESA project AIDAN and follows the years of intensive research and development of broadband solutions using microwave photonics (MWP) beamformers on the proprietary TriPleX™ platform.

Photonic Integrated Circuit (PICs) technology is gaining momentum and one of the key enablers in the different technology roadmaps over the world. MWP is a maturing field of technology, enabling new applications which are not easily achieved with full electronics solutions. LioniX International has been developing its proprietary waveguide technology (TriPleX™) into a mature technology platform with multi user access via Process Design Kits (PDKs). The hybrid integration with the complementary active Indium Phosphide (InP) technology is one of the enablers of the MWP field. This new collaboration with ViaSat recognizes the potential of this platform and enables the further maturing and upscaling of both the MWP PIC technology as well as the hybrid assembly capabilities for these modules. The project will focus on a volume manufacturable module for broadband satellite communications containing both TriPleX™ and InP PICs opening up also new possibilities in other application fields. The developments within the AIDAN project and the support this gets from ESA shows the interest in and potential of PIC technology for future applications in this field and enables LioniX international to make the next step in the maturing and upscaling of these modules.

Hans van den Vlekkert, CEO of LioniX International, commented: “This is a recognition of our integrated photonics technology platform and a major opportunity for us to show the enabling benefits of the technology in broadband communication”.

Tunable laser added to TriPleX MPW

To enable you a low cost and easy access to our photonic integrated circuit technology, we offer regular scheduled Multi Project Wafer (MPW) runs in the TriPleX™ technology. This Photonic Integration platform is suitable for components for telecom/datacom in the infrared (1550nm) region, as well as in life science applications in the visible range.

MPW Technology – 1550 nm

The TriPleX™ waveguides offered within the infrared MPW are designed for single polarization (TE) applications to operate at the telecom wavelength (1.55 µm). The waveguide is also transparent for lower wavelengths. The TriPleX™ technology has applications from 405nm to 2.35µm. In addition, these waveguides show a low propagation loss. The high contrast waveguide allows bend radii of 125 micron, which makes large scale integration (VLSI) on chip possible. The coupling to and from a fiber from this high contrast waveguide is optimized by the addition of spot size converters , which expand the mode profile to the size of a standard telecom fiber, allowing low loss fiber chip coupling.

PDK and building blocks

The MPW offering includes a process design kit (PDK) containing validated and specified building blocks. These building blocks are a good start to a design and allow the user to create many new functionalities.

Tunable laser building block

Now our MPW offering has been extended with a tunable laser building block. The building block provides the user with a narrow linewidth source. As with all other building blocks offered in our PDK, it allows the user to easily connect the items together and create a customized or application specific design. If you are interested in the current tunable laser building block specifications, please contact us.

Hybrid assembly

By offering the tunable laser building block, the MPW user gets access to our well known low-loss waveguide platform TriPleX™. Moreover our unique hybrid assembly method of attaching InP gain section to our PICs now becomes easily available for designers using the PDK.

OFC 2018

Meet LioniX International at the OFC  in San Diego, CA.

To show worldwide what LioniX International is currently working on we’ve planned varied activities during the largest global conference and exhibition for optical communications and networking professionals.

We can be found at the next activities:

  • Short course: Design, Manufacturing, and Packaging of Opto-Electronic Modules

Integrated optical modules combine advanced semiconductor technologies, optical and electronic chips, motherboards, micro-optics and heat-management to meet demanding sub-systems specifications. The assembly, packaging and testing of such modules requires increasingly sophisticated methods to ensure product meets specification. This short course will provide an insight into the packaging and testing specific to such integrated optical modules.

When: Sunday, 11 March
Time: 13:30 – 17:30
Registration: Course SC450 – Click here

 

With an increasing momentum for photonic integration and last year’s PIC workshop attracting over 378 attendees, this year will see the fifth workshop on photonic ICs at OFC. The PIC workshop is unique in the sense that it offers a material-independent one-stop-shop for anyone wanting to get started in photonic integration. The workshop is free of charge, but does require advance registration. Food and drinks will be provided and there is plenty of opportunity to network and interact with PIC service providers.

When: Wednesday, 14 March
Time: 5:45pm – 8:30pm
Where: Room 29ABCD at the San Diego Convention Center

 

This workshop will examine this opportunity for integrated photonics through plenary and invited talks by leading experts in the field covering different topics. It is targeted at companies and innovators considering or already investing in integrated photonics to meet their future product requirements, and who need to understand key manufacturing challenges and how they can be addressed.

When: Sunday, 11 March
Time: 1:30pm – 5.30pm
Where: San Diego Convention Center

 

‘Narrow Linewidth Hybrid InP-TriPleX Photonic Integrated Tunable Laser based on Silicon Nitride Micro-ring Resonators’. Co-author with Dublin City University.

When: March 15
Time: 10:30am – 00:30pm
Where: Th2A.14 Joint Poster Session II, Exhibit Hall B

Tu2I.7 Underwater Free Space Optics Systems—Continued: ‘Free Space Intra-datacenter Interconnection Utilizing 2D Optical Beam Steering‘. Co-author with Universitat Politécnica de Catalunya, Spain.

When: Tuesday March 13
Time: 3:45pm
Where: Tu2I.7 Underwater Free Space Optics Systems—Continued, Room 8

Visit us to be informed personal how LioniX International can be at your assistance.

 

We look forward meeting you during the show. If you want to make an appointment contact us by sending an email or drop by at our booth (#6122).

IMECAS & LXI intensify collaboration of PIC platforms

LioniX International (LXI) and the Institute of Microelectronics Chinese Academy of Science (IMECAS) agreed to strengthen the collaboration of their Photonic Integrated Circuit (PIC) platforms by actively supporting the functionality and offering both platforms. In the PIC landscape a number of standard platforms that are offered via Multi Project Wafer (MPW) access exist and the main platforms are Silicon On Insulator (SOI), Indium Phosphide (InP) and the silicon nitride based TriPleX™ platform. Each platform has its own pros and cons and customers should have access to implementing their application in the most suitable platform. Via this collaboration both IMECAS and LXI expand their offering and technical capabilities by offering each other’s platforms also via their channels. Both IMECAS and LXI will actively promote and enable access to both platforms enabling global customers easier access to the platforms.

LioniX International developed its proprietary waveguide technology TriPleX™ and via this collaboration they can also offer their customers SOI functionality and expertise operating as a true one stop shop for all PIC platforms.

The PIC platform of LioniX International is based on stoichiometric silicon nitride realized by Low Pressure Chemical vapor deposition and is branded under the name TriPleX™. The unique selling points are its ultra low loss (from 405 to 2350 nm) and the ability to create spot size converters. They enable an optimized conversion between the mode profiles in for example IMECAS high confinement SOI devices as well as many types of fibers.

“This collaboration with IMECAS strengthens the offering of LioniX International to also SOI, enabling us to choose between the full range of PIC platforms to best address the applications of our customers”, says Dr. Hans van den Vlekkert, CEO of LXI. ”With IMECAS we have found a supplier and partner that supports our vertical integrated approach to our photonic IC module manufacturing.”

IMECAS is the first and leading 200 mm Silicon Photonic platform in China, thanks to the profound processing capacity on a state of the art 200 mm CMOS pilot line and down to 7nm node process infrastructure developed by decades of efforts on Microelectronics since 1958. IMECAS schedules a MPW run every two months and a variety of advanced processes enabling customers to have the opportunity for rapid and cost effective scientific research and product development.

“The collaboration between LioniX International and IMECAS offers the integrated photonics community, worldwide, an excellent combination of SoI and SiN technologies that allow dense integration and diversified optical functionalities“, says Prof. Shaoxian Zhang, Director of Silicon Photonics R&D Center at IMECAS. “We also appreciate the partnership with LioniX International on joint international development, as well as providing their vertical integration capacity to serve our customers in China.

 

About Institute of Microelectronics Chinese Academy of Science:

Founded in 1958, IMECAS is the leading institute in China for Microelectronics in process and device development as well as policy and national programs making. The state of the art 200 mm CMOS pilot line and a large variety of advanced microelectronics processes enable IMECAS to provide comprehensive services on Silicon Photonics from every two-month MPW to dedicated process and device development. Strong coupling with IC and Optoelectronics industries in China also makes IMECAS a central platform of bridging Photonics and Microelectronics, facilitating the embracement of Silicon Photonics in Microelectronics, and developing Photonics industrial system referencing to the established way of working in Microelectronics.

http://english.imecas.cn/

Photonics West 2018

Meet us at Photonics West, San Francisco.

This year at the Photonics West exhibition we will show many new developments from our photonic integrated circuit modules in silicon nitride waveguide technology.

  • Optical Coherence Tomography systems based on our Photonic Integrated Circuit modules. We show the latest developments and you can see the results by:
    • a presentation at the symposium : Spectral domain, common path OCT in a handheld PIC based system, Paper 10483-55, Tuesday 30 January Time: 5:30 PM – 5:45 PM
    • In our booth (#5328) we demonstrate the OCT module and discuss the next trends in making these kind of optical system more compact and robust.
  • Ultra-narrow linewidth tunable laser. Our unique assembly capabilities of combining silicon nitride PICs with for example gain sections in InP, allows for novel devices like the ultra-narrow linewidth tunable laser. On our booth we show what linewidths are currently available as well as our toolset to match the specifications you require.
  • Furthermore during the product demonstrator we show and demonstrate how through Process Design Kit (PDK) access, hybrid Photonic Integrated Circuits (PICs) can be accessed creating a tunable ultra narrow line width laser module. Date: Tuesday 30 January 2018, Time: 3:00 PM – 3:30 PM,  Location: Demo Area 2 (Hall D North)
  • For use in Life Science and Medical applications, we have optimized  our PIC technology as well for visible light. Also this technology can be accessed via a multi-project wafer approach, lowering the barrier to start working with this. Our Visible Light MPW is offered via the PiX4life pilot-line and during the Photonics West show there are several ways to find out more:
    • PIX4life booth during BIOS exhibition: booth #8340
    • Keynote talk at the BIOS symposium: Integrated bio-photonics to revolutionize health care enabled through the European pilot lines PIX4life and PIXAPP, Paper 10506-31, Wednesday 31 January, Time: 5:00 PM – 5:20 PM
    • EPIC Pilot-line breakfast: Tuesday 30 January, 7:30am – 9:30am. More info and registration here.

Looking forward to meet you during the show. If you want to make an appointment contact us or drop by our booth (#5328)

News from BioMEANDER project

Drie MKB’s en Universiteit Twente ontwikkelen extreem gevoelig platform voor eiwit- en virusdetectie

MKB-ondernemingen Lead Pharma, LioniX en Surfix ontwikkelen samen met de Universiteit Twente een biologisch detectieplatform dat een tot wel honderd keer hogere gevoeligheid heeft dan bestaande technieken. De partijen gaan het platform inzetten voor onder meer het screenen van kandidaat-medicijnen en om een zeer selectieve virusdetector te ontwikkelen. Voor het project BioMEANDER ontvangen de partners een R&D samenwerkingssubsidie van 800 duizend euro uit het EFRO programma OP Oost. Zelf investeren ze tot eind 2019 in totaal 1,2 miljoen euro in het project.

De gehele nieuwsbrief is hier te lezen

Fraunhofer helps PHIX on its way to large-scale production photonics chips

The Fraunhofer Project Center, on the campus of the University of Twente, will develop a special micro-assembly machine for photonic chips. This is an important step from small series to large-scale production in Twente, through the new PHIX Photonics Assembly. Fraunhofer presents the machine at the MicroNano Conference in Amsterdam on 12 and 13 December.

Read the press release here.

PHIX and Tyndall Institute strengthen their collaboration

PHIX Photonics assembly (PHIX) and PIXAPP Pilot Line Coordinator Tyndall Institute have strengthened their collaboration in the development of the photonic packaging ecosystem by arranging dedicated training of PHIX engineers on Tyndall’s advanced packaging equipment. This sharing of knowledge will strengthen the photonic ecosystem in Europe and assure open access to high volume Photonic Integrated Circuit (PIC) packaging through the PIXAPP Pilot Line.

Find here the complete press release.

AMC and LioniX International strengthen their collaboration

LioniX International (LXI) and Academic Medical Center (AMC) of the University of Amsterdam strengthen the collaboration of their activities in the field of Photonic Integrated Circuit (PIC) based Optical Coherence Tomography (OCT) modules. The implementation of PIC based technologies in OCT modules will enable miniaturized handheld OCT modules broadening the scope and application field of OCT based systems.

Read the complete press release.

PHIX Photonics Assembly established

Establishment of PHIX Photonics Assembly is an important step for scaling photonic integration into emerging markets, like 5G, datacom  as well as biophotonics. All markets need a high volume photonics assembly and packaging facility. LioniX International is proud to be at the forefront of making integrated photonics happen.

See for more information the press-release on the PHIX photonics assembly website.