Optimize your solution with assembly and packaging
The effectiveness of your photonic integrated circuit (PIC) depends on much more than just the optics on-chip. We deliver the results you need from your solution. Whether it’s seamless integration, efficient operation, easy characterization or robust performance, we specialize in the assembly and packaging approaches to maximize the value of your device.
As a vertically integrated company, LioniX International offers solutions and services at all volume levels and development stages. From prototypes, demonstration models and small-volume end products to volume production runs. We offer both standardized and custom PIC packaging services to meet any requirement.
Available assembly and packaging services for PIC modules
Our services support you with the realization of your complete optical system. From singulation and characterization of bare chips and pieces of wafers to pigtailing of fibers and fiber arrays to PICs, hybrid integration of different PICs and to mounting the optical assembly including the driving electronics in standardized or customized housings. Specific services include:
Fiber or fiber array to PIC coupling
Fibre couplings can be a significant source of loss in your optical system. With over 30 person-years of experience of fibre coupling, we have the expertise and technology to ensure your fibre interfaces are not your weak link. We work with integrated optical technologies like InP, SOI, glass or Silicon nitride TriPleX™ and can attach standard single mode fibers or specialty fibers one or multiple facets of the PIC.
Hybrid integration PIC to PIC
Hybrid integration leverages the benefits of more than one PIC technology platform to deliver exciting functionality. But it requires precise management of light, PIC interfaces and alignment to ensure proper operation. We work with spotsize and mode conversion between single mode fiber and high contrast PIC technology and offer services to assemble multiple PICs. We regularly use spotsize and pitch converter to attached a TriPleX™ PIC to an InP high contrast PIC.
Specialty fiber arrays
Besides the standard single mode fiber arrays, we also offer specialty fiber arrays. These consist of polarization maintaining or non-telecom fibers or have multiple fiber types in a single fiber array. Also the outer dimension of the fiber array can be adapted to create very thin fiber arrays.
Integration of electronics with PIC submount
Many applications require a PIC to be driven through an electronic interface. LioniX International integrates different types of electrical interfaces by wirebonding and flip-chipping to PCB or ceramics.
Mircofluidic and optofluidic interfaces
Combine the power of integrated optics and fluidic handing. With applications in life science, organ on a chip and lab on a chip. We design solutions for fluidic cartridges and interfaces that integrate seamlessly with integrated optical functionality.
Photonic component package
We offer several standard and customized packages for prototype assembly. The PIC assembly is wirebonded and strain-reliefs are added to create a robust module. Active temperature control is established through use of peltier elements and customized heatsinks to suit your application best.
Characterization Packaging Service
For cost effective, robust and hassle-free interfaces with your PIC for easy characterization and testing, our Characterization Packaging service is the ideal package for research and development and prototyping. It is idea for use as part of our multi project wafer (MPW) service.